Process Capability

Process Capability

Capability

ItemStandardAdvanced
Max. Layer Counts5270
Max. Board Thickness6.35mm7.0mm
Min. Core Thickness0.075mm0.05mm
Max. Board Size560mm*711mm560mm*711mm
Trace & SpaceInner50 / 60um50 / 50um
Outer75 / 75um60 / 75um
Min. Drilled Size0.15mm0.1mm (Board Thickness≦1.6mm)
縱橫比 Aspect Ratio~33.3~42.3
Drill to Copper 鑽孔距銅箔DUT Area0.125mm0.1 mm
Other Area0.15 mm0.125 mm
Routing Tolerance+/- 0.125mm+/- 0.1mm
Solder Mask Dam下墨間距0.1mm Min.0. 075mm Min.
Blind Mechanical Vias盲孔機鑽0.15mm0.15mm
Buried Mechanical Vias埋孔機鑽0.15mm0.15mm
Laser Drilled Micro vias雷鑽0.1mm0.05mm
Mechanical Depth Drills Vias 盲深度控制+/- 0.125mm+/- 0.1mm
銅厚 Copper WeightsMin. Outer1/2 oz1/3 oz
Min. Inner1/2 oz1/3 oz
Max. Outer3 oz6 oz
Max. Inner3 oz6 oz
via on pad 製程YesYes
Impedance ControlInner+/- 8~10%+/- 5~10%
Outer+/- 10%+/- 5~10%
HDI 多層次疊合製程1+N+1, 2+N+2, 3+N+3Any Layer
Item Standard Advanced
Max. Layer Counts  52  70
Max. Board Thickness  6.35mm  7.0mm
Min. Core Thickness  0.075mm  0.05mm
Max. Board Size  560mm*711mm  560mm*711mm
Trace & Space Inner  50 / 60um  50 / 50um
Outer  75 / 75um  60 / 75um
Min. Drilled Size  0.15mm  0.1mm (Board Thickness≦1.6mm)
縱橫比 Aspect Ratio  ~33.3  ~42.3
Drill to Copper 鑽孔距銅箔 DUT Area 0.125mm 0.1 mm
Other Area 0.15 mm 0.125 mm
Routing Tolerance +/- 0.125mm +/- 0.1mm
Solder Mask Dam下墨間距 0.1mm Min. 0. 075mm Min.
Blind Mechanical Vias盲孔機鑽 0.15mm 0.15mm
Buried  Mechanical Vias埋孔機鑽 0.15mm 0.15mm
Laser Drilled Micro vias雷鑽 0.1mm 0.05mm
Mechanical Depth Drills Vias 盲深度控制 +/- 0.125mm +/- 0.1mm
銅厚 Copper Weights Min. Outer 1/2 oz 1/3 oz
Min. Inner 1/2 oz 1/3 oz
Max. Outer 3 oz 6 oz
Max. Inner 3 oz 6 oz
via on pad 製程 Yes Yes
Impedance Control Inner +/-   8~10% +/-  5~10%
Outer +/-  10% +/-  5~10%
HDI 多層次疊合製程 1+N+1, 2+N+2, 3+N+3   Any Layer

Drill /Plating 制程能力

通孔电镀能力

Pitch板厚孔徑縱橫比最小孔銅厚度最大孔銅厚度
0.35mm5.0mm0.125mm400.4mil0.6mil
0.4mm6.35mm0.15mm42.30.4mil1.0mil
0.5mm6.35mm0.2mm31.80.4mil1.0mil

Pitch 板厚 孔徑 縱橫比 最小孔銅厚度 最大孔銅厚度
0.35mm 5.0mm 0.125mm 40 0.4mil 0.6mil
0.4mm 6.35mm 0.15mm 42.3 0.4mil 1.0mil
0.5mm 6.35mm 0.2mm 31.8 0.4mil 1.0mil

背钻能力

 

 標準高級
A : Drill Size  
B : Back drillA+8 mil Min.A+4 mil Min.
C : ClearanceA+16 mil Min.A+8 mil Min.
D : Stub(殘留)16 mil Max.12 mil Max.

標準 高級
   A : Drill Size
   B : Back drill    A+8 mil Min.    A+4 mil Min.
   C : Clearance    A+16 mil Min.    A+8 mil Min.
   D : Stub(殘留)    16 mil Max.    12 mil Max.

Fine pitch PCB Technology

 Unit : mm

Pitch 0.35mm

Drill0.15
Board Thickness5.0
PAD0.25
Trace Width0.04
Clearance0.08

Pitch 0.4mm

Drill0.15
Board Thickness5.0
PAD0.3
Trace Width0.05
Clearance0.1

Pitch 0.5mm

Drill0.2mm
Board Thickness6.35
PAD0.35
Trace Width0.05
Clearance0.125

Unit : mm

Pitch 0.35mm

   Drill    0.15
   Board Thickness    5.0
   PAD    0.25
   Trace Width    0.04
   Clearance    0.08

Pitch 0.4mm

     Drill    0.15
     Board Thickness    5.0
     PAD    0.3
     Trace Width    0.05
     Clearance    0.1

Pitch 0.5mm

   Drill    0.2mm
   Board Thickness    6.35
   PAD    0.35
   Trace Width    0.05
   Clearance    0.125