Process Capability
| Item | Standard | Advanced | |
| Max. Layer Counts | 52 | 70 | |
| Max. Board Thickness | 6.35mm | 7.0mm | |
| Min. Core Thickness | 0.075mm | 0.05mm | |
| Max. Board Size | 560mm*711mm | 560mm*711mm | |
| Trace & Space | Inner | 50 / 60um | 50 / 50um |
| Outer | 75 / 75um | 60 / 75um | |
| Min. Drilled Size | 0.15mm | 0.1mm (Board Thickness≦1.6mm) | |
| 縱橫比 Aspect Ratio | ~33.3 | ~42.3 | |
| Drill to Copper 鑽孔距銅箔 | DUT Area | 0.125mm | 0.1 mm |
| Other Area | 0.15 mm | 0.125 mm | |
| Routing Tolerance | +/- 0.125mm | +/- 0.1mm | |
| Solder Mask Dam下墨間距 | 0.1mm Min. | 0. 075mm Min. | |
| Blind Mechanical Vias盲孔機鑽 | 0.15mm | 0.15mm | |
| Buried Mechanical Vias埋孔機鑽 | 0.15mm | 0.15mm | |
| Mechanical Depth Drills Vias 盲深度控制 | +/- 0.125mm | +/- 0.1mm | |
| 銅厚 Copper Weights | Min. Outer | 1/2 oz | 1/3 oz |
| Min. Inner | 1/2 oz | 1/3 oz | |
| Max. Outer | 3 oz | 6 oz | |
| Max. Inner | 3 oz | 6 oz | |
| via on pad 製程 | Yes | Yes | |
| Impedance Control | Inner | +/- 8~10% | +/- 5~10% |
| Outer | +/- 10% | +/- 5~10% | |
| Item | Standard | Advanced | |
| Max. Layer Counts | 52 | 70 | |
| Max. Board Thickness | 6.35mm | 7.0mm | |
| Min. Core Thickness | 0.075mm | 0.05mm | |
| Max. Board Size | 560mm*711mm | 560mm*711mm | |
| Trace & Space | Inner | 50 / 60um | 50 / 50um |
| Outer | 75 / 75um | 60 / 75um | |
| Min. Drilled Size | 0.15mm | 0.1mm (Board Thickness≦1.6mm) | |
| 縱橫比 Aspect Ratio | ~33.3 | ~42.3 | |
| Drill to Copper 鑽孔距銅箔 | DUT Area | 0.125mm | 0.1 mm |
| Other Area | 0.15 mm | 0.125 mm | |
| Routing Tolerance | +/- 0.125mm | +/- 0.1mm | |
| Solder Mask Dam下墨間距 | 0.1mm Min. | 0. 075mm Min. | |
| Blind Mechanical Vias盲孔機鑽 | 0.15mm | 0.15mm | |
| Buried Mechanical Vias埋孔機鑽 | 0.15mm | 0.15mm | |
| Laser Drilled Micro vias雷鑽 | 0.1mm | 0.05mm | |
| Mechanical Depth Drills Vias 盲深度控制 | +/- 0.125mm | +/- 0.1mm | |
| 銅厚 Copper Weights | Min. Outer | 1/2 oz | 1/3 oz |
| Min. Inner | 1/2 oz | 1/3 oz | |
| Max. Outer | 3 oz | 6 oz | |
| Max. Inner | 3 oz | 6 oz | |
| via on pad 製程 | Yes | Yes | |
| Impedance Control | Inner | +/- 8~10% | +/- 5~10% |
| Outer | +/- 10% | +/- 5~10% | |
| HDI 多層次疊合製程 | 1+N+1, 2+N+2, 3+N+3 | Any Layer | |
| Pitch | 板厚 | 孔徑 | 縱橫比 | 最小孔銅厚度 | 最大孔銅厚度 |
| 0.35mm | 5.0mm | 0.125mm | 40 | 0.4mil | 0.6mil |
| 0.4mm | 6.35mm | 0.15mm | 42.3 | 0.4mil | 1.0mil |
| 0.5mm | 6.35mm | 0.2mm | 31.8 | 0.4mil | 1.0mil |
| Pitch | 板厚 | 孔徑 | 縱橫比 | 最小孔銅厚度 | 最大孔銅厚度 |
| 0.35mm | 5.0mm | 0.125mm | 40 | 0.4mil | 0.6mil |
| 0.4mm | 6.35mm | 0.15mm | 42.3 | 0.4mil | 1.0mil |
| 0.5mm | 6.35mm | 0.2mm | 31.8 | 0.4mil | 1.0mil |
| 標準 | 高級 | |
| A : Drill Size | ||
| B : Back drill | A+8 mil Min. | A+4 mil Min. |
| C : Clearance | A+16 mil Min. | A+8 mil Min. |
| D : Stub(殘留) | 16 mil Max. | 12 mil Max. |
| 標準 | 高級 | |
| A : Drill Size | ||
| B : Back drill | A+8 mil Min. | A+4 mil Min. |
| C : Clearance | A+16 mil Min. | A+8 mil Min. |
| D : Stub(殘留) | 16 mil Max. | 12 mil Max. |
 | |
| Unit : mm | |
Pitch 0.35mm | |
| Drill | 0.15 |
| Board Thickness | 5.0 |
| PAD | 0.25 |
| Trace Width | 0.04 |
| Clearance | 0.08 |
Pitch 0.4mm | |
| Drill | 0.15 |
| Board Thickness | 5.0 |
| PAD | 0.3 |
| Trace Width | 0.05 |
| Clearance | 0.1 |
Pitch 0.5mm | |
| Drill | 0.2mm |
| Board Thickness | 6.35 |
| PAD | 0.35 |
| Trace Width | 0.05 |
| Clearance | 0.125 |
| Unit : mm | |
|
Pitch 0.35mm |
|
| Drill | 0.15 |
| Board Thickness | 5.0 |
| PAD | 0.25 |
| Trace Width | 0.04 |
| Clearance | 0.08 |
|
Pitch 0.4mm |
|
| Drill | 0.15 |
| Board Thickness | 5.0 |
| PAD | 0.3 |
| Trace Width | 0.05 |
| Clearance | 0.1 |
|
Pitch 0.5mm |
|
| Drill | 0.2mm |
| Board Thickness | 6.35 |
| PAD | 0.35 |
| Trace Width | 0.05 |
| Clearance | 0.125 |
