1990	•	Company established mainly for converting customer's PCB data from Gerber format to CAM data and generating manufacturing artwork by laser plotter.
1993	•	A production line capable of making PCB prototypes with high efficiency established.
1995	•	A mass production line built to enhance manufacturing capacity.
	•	Multi-layers for mass production enabled.
	•	UL certification granted.
1996	•	Production capacity expanded and computerized production management information system (MIS) introduced.
	•	ISO-9002 certification awarded.
1997	•	New facility of 108,000 square feet built next to its original facility.
	•	US$ 6 million invested in the new facility to provide quality inspection and Just-In-Time services.
	•	Systematic quality inspection mechanism implemented throughout the whole production process.
1998	•	SPC (Statistical Process Control) implemented after demonstrating consistency in product quality.
	•	Capable of making 600 ~ 800 different kinds of prototypes/samples per month.
	•	Production capacity increased to 200,000 square feet per month.
	•	Manufacturing capability of up to 20-layer achieved.
1999	•	Set foot in Mainland China (Canton province) to ensure low pricing and better access to our PCB products.
	•	Publicly traded on OTC market.
	•	ISO-9002, ISO-14000, TL9000 and UL certified for both Taiwan and Canton plants.
	•	UL certification for heavy copper granted.
2001	•	Canton plant expanded to 250,000 square feet.
	•	Sequential lamination for blind/buried vias introduced.
	•	Capable of multi-layers manufacturing for High Current & High Power design.
2002	•	Shanghai (Kunshan plant) plant established with total area of 162,000 square feet.
	•	Manufacturing capability up to 36-layer.
	•	FMEA (Failure Model and Effective Analysis) implemented to assist precise and efficient production.
2003	•	Sales turnover reached US$55 million.
	•	HDI line for build up process built and Plotech became the only High Mix, High Volume PCB Manufacturer in South East Asia.
2004	•	After three years of HDI operation, Plotech's HDI lines in both Taiwan and Shanghai facilities are now capable of supplying quality boards with blind/buried design in large volume.
	•	Flex-Rigid and BGA substrate manufacturing will be introduced to all facilities in 2006.